Our new high density (HD)+ card edge connector delivers the highest current density in the market at 15A/2.54mm and supports 2000-3000W power supplies for data center equipment.

A unique design with dual layers of DC power contacts and pass-through pins provide multiple mating/contact points to the PCB which helps ensure low contact resistance and supports higher current. The signal pitch is 1.27mm, which is compatible with common industry PCB footprint designs.

·    Servers

·    Switches

·    Storage devices

·    Delivers the highest current density of any card edge connector in the market at 15A/2.54mm

·    Supports 2000-3000W power supplies for data center equipment

·    Unique dual layer design of DC power contacts and pass-through pins provides multiple mating/contact points to the PCB which helps ensure low contact resistance at 1 mΩ max

·    Meets common industry PCB footprint designs with 1.27mm signal pitch, 5.08mm power contact pitch

·    Provides lower temperature rising and lower power loss on the connector

·    Compact and cost-effective with common power and signal contact modules

·    Flexible configurations available with different contact quantities

·    Better scalability (AC & DC, low power & high power)

·    Excellent mechanical and electrical performance

·    Easy mating/un-mating with proper retention force

·    Mating force 80N max with nominal mating PCB

·    What current density does your application require?

·    What is the signal pitch in the PCB footprint of your application?

·    What is the operating temperature in your application?

·    What is the mating force requirement in your application?

·    Do you need a footprint compatible with other vendors?

·    Is UL certification/ROHS/HF necessary?

·    Amphenol FCI – eHPCE^® Enhanced High Power Card Edge Connector

·    Jonhon – power card edge connectors